Non-destructive approaches provide valuable information but do not always resolve the underlying problem. Internal interfaces may remain inaccessible, and competing failure hypotheses may not be ...

The performance of today’ electronic products relies heavily on the integrity of the tiny connections between microchips and circuits, which can number as many as 2,200. These bonds are tested ...

Lightweight design is increasingly applying trend-setting hybrid structures made of fiber composite materials and lightweight metal alloys, combining the advantages of both types of materials in ...

The revised USP Chapter Sterile Product Packaging-Integrity Evaluation gives best practices for obtaining reliable data in container closure integrity testing and recommends quantitative deterministic ...