Abstract: Recently, model predictive control is widely applied in practice. To enhance the robustness of the controlled system, model-free predictive control is singled out as an alternative solution.
Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.
一些您可能无法访问的结果已被隐去。
显示无法访问的结果